IC peak & place Handler
■ Suitable for final test
■ Temperature test from -40~125˚C
■ Support chip package size from 3×3 mm to 45×45 mm
■ Up to four output trays
■ Remote control operation
■ Yield monitoring function
■ Intelligent auto retest & auto retry
■ Real-time tray status
■ Able to integrated with Chroma hybrid chiller
■ Support TSD control
■ Best engineering platform for testing tri-temp characterization
■ Max UPH : Up to 500 pcs
■ Contact force control from 1 to10 kg (option)
■ Support socket temperature compensation module (STCM)
■ Support system level test (SLT) (option)
■ FT + SLT Handler – Two In One
■ Perfect for Device Engineering Characterization Gathering and Analysis
■ Auto Tray Load/unload & Device Sorting capability
■ Without socket damage issue
■ Air damper for good contact balance
■ Shuttle remain IC check function
■ Camera for real time system monitoring
■ Optional Tri-temp IC test function (-55℃ ~ 150℃)
■ High power cooling function (option)
■ Diskless download function (option)
■ System Level Test Applications (SLT)
■ Handler dimensions : 600 mm (W) x 570 mm (D) x 860 mm (H)
■ Test interface window of up to 200 mm (W) x 200 mm (D) of test board dimensions
■ Tabletop design for smaller table space 60 cm2
■ (2) Fixed JEDEC trays
■ IC package size ranges : 5×5 mm to 45×45 mm
■ Software configurable binning
■ Air damper contact head
■ Optimized IC force balance
■ Allows for maximizing the test socket lifetime
■ Protection against IC double stacking and incorrect device placement orientation
■ Continuous automated re-test capabilities
■ Ambient to 125℃ of operational mode
■ 1/3000 of jam rate
■ CE marked & certified
■ Advance thermal technology (Nitro TEC)
■ Faster index time 0.6 sec
■ Active thermal control and full range temperature
■ Chamber less design
■ Support multiple sites – Single site (option) – Dual sites : 1 x 2 (80 mm) – Quad sites : 1 x 4 (40 mm) ; 2 x 2 (80 x 60 mm) – Octal sites : 2 x 4 (40 x 60 mm) (option)
■ Simple, quick kit changeover
■ Reliable high-speed pick & place handler
■ Auto contact-force learning
■ Gull wing package capability
■ No socket damage
■ Air damper for contact balance
■ IC-in-socket protection
■ Invention patent 190373, 190377, 1227324 & 125307
■ Thermal Control Configurations – Tri Temp Control – Close-Loop Active Thermal Control (ATC) Module – Unity PTC (Passive Thermal Control)
■ Up to x8 parallel test sites
■ Up to 9000 UPH
■ Jam Rate 1/10000
■ Flexible test site configuration
■ Dampened contact force
■ 3×3 mm ~ 50×50 mm packages
■ Temperature test from ambient ~ 150 ℃
■ Intelligent auto retest & auto retry
■ Yield monitor
■ Socket auto clean function* (option)
■ Two in one shuttle
■ CE marked and certified
■ Cost-effective Integrated RF Solution
■ Customized RF Isolation Chamber with Integrated Tester Docking
■ Up to 120 mm Test Site Pitch
■ Up to x8 Parallel Test Site
■ 3×3 mm ~ 45×45 mm Package
■ Precise Positioning
■ Compatible with JEDEC and EIAJ tray
■ Reliable high-speed pick & place handler
■ Tester zero waiting time
■ Gull wing package capability
■ No socket damage
■ Air damper for contact balance
■ IC-in-socket protection
■ NS-5000/6000 change kits compatible KEY FEATURES C
Chroma 3270 is an innovative handler for high volume/multisite miniature IC testing, especially for CIS Testing (CMOS Image Sensor), at system level. It is capable of handling devices of a large variety of package types including QFP, TQFP, BGA, PGA, etc. The handler uses pick and place technology to pick up devices from JEDEC trays, move them to the test site, then move them to the appropriate bin after test. Chroma 3270 can handle 16 devices for parallel test at ambient temperature to high temperature 50˚C. M
■ High throughput for CIS Testing
■ Reliable high-speed pick & place handler
■ 3×3 mm miniature device handling capability
■ Air damper for contact balance
■ Socket damage free KEY FEATURES
